lead-free parts pb ligitek electronics co.,ltd. property of ligitek only dual color led lamps LYSBKS2093 data sheet - 2007 b 07 - feb. doc. no : qw0905- rev. : date : LYSBKS2093
25% note : 1.all dimension are in millimeter tolerance is LYSBKS2093 part no. 75% 50% 100% 30
---- 585 peak wave length pnm typ. 3.5 ---- 50 electrostatic discharge( * ) esd --- v 500 2/6 sbks page unit y symbol LYSBKS2093 parameter ligitek electronics co.,ltd. property of ligitek only ratings part no. absolute maximum ratings at ta=25 10 120 100 a mw ma 80 60 i fp ir pd t opr tstg -20 ~ +80 -30 ~ +100 viewing angle 2 1/2 (deg) 30 30 typ. min. luminous intensity @20ma(mcd) min. max. forward voltage @20ma(v) ---- 1.7 4.2 2.6 dominant wave length dnm lens ---- 475 emitted material blue yellow ingan/sic gaasp/gap water clear color 26 35 spectral halfwidth nm operating temperature LYSBKS2093 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) part no storage temperature reverse current @5v peak forward current duty 1/10@10khz power dissipation 30 ma 20 forward current i f static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * 21 38 120 220
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( $ ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 $ fig.4 relative intensity vs. temperature ambient temperature( $ ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 $ typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 0 80 100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. page3/6 LYSBKS2093
4/6 page ligitek electronics co.,ltd. property of ligitek only part no. LYSBKS2093 1.25 1.5 fig.2 relative intensity vs. forward current 20 10 15 25 30 0.5 0.75 0.25 0 forward voltage(v) 5 0 3 4 5 forward current(ma) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.0 sbk-s chip 20 25 30 15 10 5 0 1 f o r w a r d c u r r e n t ( m a ) typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 2 1.0 0.5 fig.4 relative intensity vs. wavelength wavelength (nm) 75 50 100 r e l a t i v e i n t e n s i t y @ 2 0 m a 580 380 0 480 480 430 530 630 680 30 40 20 10 0 f o r w a r d c u r r e n t @ 2 0 m a 0 fig.3 forward current vs. temperature ambient temperature( ) 25
120 seconds max ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) page 5/6 260 c3sec max 5 /sec max temp( c) 260 ! time(sec) 200 250 2 /sec max 120 ! 25 ! preheat 0 ! 0 100 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. dip soldering preheat: 120 c max preheat time: 120seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. LYSBKS2093
page 6/6 ligitek electronics co.,ltd. property of ligitek only reference standard description mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reliability test: test item operating life test high temperature storage test low temperature storage test 1.ta=105
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